wordrona
  • AC power supply: A power supply that provides an AC voltage.
  • AC: Alternating Current.
  • ADC (Analog-to-Digital Converter): A device that converts an analog signal to a digital representation.
  • Amplifier: A device that increases the amplitude of an electrical signal.
  • Antenna: A device that transmits or receives electromagnetic waves.
  • Auto-routing: The use of computer software to automatically route the traces on a PCB.
  • Bandwidth: The range of frequencies that a circuit or device can process.
  • Bode plot: A graph that shows the frequency response of a circuit.
  • Boost converter: A type of switching converter that increases the input voltage.
  • Breadboard: A type of prototyping board used to build and test electronic circuits.
  • Buck converter: A type of switching converter that reduces the input voltage.
  • Buck-boost converter: A type of switching converter that can either increase or decrease the input voltage.
  • Burn-in testing: A method of testing a PCB by running it at high temperatures for an extended period of time to detect any latent defects.
  • CAN (Controller Area Network): A communication protocol that can be used to connect multiple devices in a vehicle or industrial control system.
  • Capacitance (C): The ability of a circuit to store electrical energy in an electric field, measured in farads (F).
  • Circuit analysis: The process of using mathematical methods to understand the behavior of a circuit.
  • Circuit: A closed path through which electrical current flows.
  • Clipper: A circuit that removes a portion of an input signal above or below a certain level.
  • Common-mode noise: Noise that is present on both the positive and negative terminals of a signal.
  • Comparator: A device that compares two input signals and generates an output signal based on their relative values.
  • Counter: A device that counts the number of input pulses.
  • Coupling: The transfer of energy from one circuit or device to another.
  • Crossover: A circuit that separates an audio signal into different frequency ranges.
  • Current (I): The flow of electric charge through a circuit, measured in amperes (A).
  • DAC (Digital-to-Analog Converter): A device that converts a digital signal to an analog representation.
  • DC power supply: A power supply that provides a constant DC voltage.
  • DC: Direct Current.
  • Decoders: A device that converts a digital signal into a physical motion or position.
  • Demultiplexer (DEMUX): A device that routes a single input signal to one of several outputs.
  • Differential-mode noise: Noise that is present on the difference between the positive and negative terminals of a signal.
  • Diode: A semiconductor device that allows current to flow in one direction but not the other.
  • Divider: A circuit that divides one input signal by another.
  • DMA (Direct Memory Access): A method of transferring data directly between memory and a peripheral device without involving the microcontroller.
  • Embedded systems: A combination of hardware and software that performs specific tasks and is designed to be integrated into a larger system.
  • EMI (Electromagnetic Interference): Unwanted electromagnetic energy that can interfere with the normal operation of electronic devices.
  • EMI filter: A device that helps reduce the level of EMI in a circuit.
  • Encoder: A device that converts a physical motion or position into a digital signal.
  • Envelope detector: A circuit that extracts the envelope of a modulated signal.
  • ESD (Electrostatic Discharge): The sudden flow of electricity between two objects caused by contact or proximity.
  • ESD protection: A circuit or device that helps protect electronic components from ESD damage.
  • Ethernet: A communication protocol that can be used to connect multiple devices in a local area network (LAN) or wide area network (WAN).
  • FEM (Finite Element Method) : a simulation technique used to analyze electromagnetic fields.
  • Ferrite bead: A passive component that helps suppress EMI and RFI in a circuit.
  • Filter: A circuit that passes certain frequencies and attenuates others.
  • Firmware: Software that is permanently stored on a device and controls its basic functions.
  • Flip-flop: A circuit that stores one bit of data and has two stable states.
  • Flyback converter: A type of switching converter that is used in applications where the output voltage is higher than the input voltage.
  • Fourier transform: A mathematical technique used to analyze circuits with frequency-domain signals.
  • Functional testing: A method of testing a PCB by measuring its ability to perform its intended functions.
  • Fuse: A safety device in an electric circuit that melts when too much current flows through it, thereby breaking the circuit.
  • Gerber file: A file format used to describe the layout of a PCB, which can be used to fabricate the PCB.
  • Ground loop: An unwanted current flow through a ground connection caused by a difference in ground potentials between two or more points in a circuit.
  • Ground plane: A large area of a PCB that is used as a reference plane for the circuit and helps reduce EMI and RFI.
  • Ground: A reference point in a circuit from which other voltages are measured.
  • Here are some additional circuit terminology and related definitions:
  • Here are some common circuit terminology and related definitions:
  • I2C (Inter-Integrated Circuit): A communication protocol that can be used to connect multiple devices to a microcontroller using only two wires.
  • IGBT (Insulated-Gate Bipolar Transistor): A type of power electronic device that can be used as a switch or an amplifier.
  • Impedance: The combined effects of resistance, inductance, and capacitance in a circuit.
  • In-circuit testing (ICT): A method of testing a PCB by connecting a test probe to various points on the circuit and measuring the electrical characteristics.
  • Inductance (L): The ability of a circuit to store energy in a magnetic field, measured in henrys (H).
  • Inductor: An electronic component in a circuit that stores energy in a magnetic field when electric current flows through it.
  • Integrated circuit (IC): A compact arrangement of transistors, diodes, and other components on a single piece of semiconductor material.
  • Interrupt service routine (ISR): A small program that is executed when an interrupt is received.
  • Interrupt: A signal that temporarily halts the normal execution of a program and causes the microcontroller to perform a specific task.
  • Inverter: A circuit that changes DC voltage to AC voltage.
  • Isolation: The process of electrically separating two or more circuits to prevent current flow between them.
  • It’s worth noting that this list is not exhaustive and there are many other terms and concepts related to circuit terminology.
  • Kirchhoff’s laws: A set of laws that describe the conservation of charge and energy in a circuit.
  • Laplace transform: A mathematical technique used to analyze circuits with time-varying signals.
  • LDO (Low-Dropout Regulator): A type of linear regulator that can provide a stable output voltage with a low dropout voltage.
  • Linear power supply: A power supply that uses a linear regulator to maintain a constant output voltage.
  • Logic gate: An electronic circuit that performs a Boolean logic operation (e.g. AND, OR, NOT).
  • Memory: A device or circuit that stores data for future use.
  • Mesh: A loop of current in a circuit.
  • Microcontroller: A small computer on a single integrated circuit that can be programmed to control various devices and perform complex tasks.
  • Mixer: A circuit that combines two or more signals.
  • Modulator: A circuit that modifies an input signal in some way.
  • MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor): A type of power electronic device that can be used as a switch or an amplifier.
  • Multiplexer (MUX): A device that routes one of several input signals to a single output.
  • Multiplier: A circuit that multiplies two input signals.
  • New chat
  • Node: A point in a circuit where multiple components or traces are connected.
  • Noise generator: A circuit that generates random electrical noise.
  • Norton’s theorem: A theorem that states that any combination of current sources and resistors can be replaced by a single current source in parallel with a single resistor.
  • Note that the list provided above is not exhaustive but it contains more common and fundamental terms.
  • Note that this list is not exhaustive and there are many other terms and concepts related to circuit terminology.
  • Note: It’s not possible to list all the circuit terminology and related definitions, the above list includes the most common and fundamental terms.
  • Nyquist plot: A graph that shows the stability of a circuit.
  • Open Circuit: An abnormal condition on an electrical circuit, where a current is unable to flow through its intended path due to a break or malfunction in the circuit.
  • Oscillator: A circuit that generates a repeating waveform.
  • Oscilloscope: An electronic instrument used to visualize electrical signals in a circuit.
  • PCB 3D model file: A file format used to describe the 3D geometry and physical properties of a PCB or component.
  • PCB 3D visualization software: A computer program used to view and edit the 3D geometry and physical properties of a PCB or component.
  • PCB assembly drawing file: A file format used to describe the placement, orientation, and other details of the components on a PCB for the assembler.
  • PCB assembly drawing: A technical drawing that specifies the placement, orientation, and other details of the components on a PCB for the assembler.
  • PCB assembly process: The process of assembling the components onto a PCB.
  • PCB assembly software: A computer program used to generate the files and instructions needed for the assembly of a PCB.
  • PCB assembly: The process of attaching electronic components to a printed circuit board.
  • PCB bill of materials (BOM) file: A file format used to describe the list of components and materials required to build a circuit or PCB.
  • PCB bill of materials (BOM): A list of all the components, materials, and other items required to build a PCB.
  • PCB bondply: A layer of adhesive film that is used to bond the layers of a multi-layer PCB together.
  • PCB cleaning: The process of removing dirt, dust, and other contaminants from a PCB to maintain its performance and reliability.
  • PCB coating: The process of applying a protective coating on a PCB to protect it from environmental factors such as moisture, dust, and chemicals.
  • PCB collaboration software: A computer program used to share, review and collaborate with other team members on the design and development of a circuit or PCB.
  • PCB conformal coating: The process of applying a thin layer of protective material on a PCB to protect it from environmental factors such as moisture and dust.
  • PCB copper corrosion: The degradation of the copper traces or planes on a PCB due to exposure to moisture, chemicals, or other environmental factors.
  • PCB copper density: The amount of copper present per unit area on a PCB, typically measured in ounces per square foot (oz/ft²) or grams per square meter (g/m²).
  • PCB copper etching: The process of removing unwanted copper from a PCB substrate to create the traces and planes of a circuit.
  • PCB copper fill: A process of filling the unused areas of a PCB with copper to improve the heat dissipation and electromagnetic shielding of the circuit.
  • PCB copper finish: The surface finish of the copper traces and planes on a PCB, which can include options such as electrolytic nickel gold (ENIG), immersion tin (ISn), and electroless nickel immersion gold (ENIG).
  • PCB copper mirroring: The phenomenon of copper migration from one trace to another due to mismatches in trace width, spacing or voltage potential.
  • PCB copper oxidation: The formation of a thin layer of copper oxide on the surface of the copper traces or planes on a PCB, which can affect the electrical conductivity and mechanical strength of the copper.
  • PCB copper peel strength: The force required to remove copper from a PCB substrate, typically measured in pounds per inch (lb/in) or Newtons per millimeter (N/mm).
  • PCB copper planarity: The degree to which the copper surface is flat and smooth on a PCB.
  • PCB copper plating: The process of depositing a layer of copper on a PCB substrate to create the traces and planes of a circuit.
  • PCB copper pour: A filled area of copper on a PCB that is used as a ground or power plane.
  • PCB copper thickness: The thickness of the copper on a PCB, measured in thousandth of an inch (mils).
  • PCB copper thickness: The thickness of the copper traces and planes on a PCB, which is typically measured in micrometers.
  • PCB copper weight: The thickness of the copper on a PCB, measured in ounces per square foot (oz/ft^2).
  • PCB copper weight: The thickness of the copper traces and planes on a PCB, which is typically measured in ounces per square foot (oz/ft²) or micrometers.
  • PCB core layer: The central layer of a multi-layer PCB that provides structural support and electrical connectivity.
  • PCB design for assembly (DFA): The process of designing a PCB to optimize the assembly process and minimize costs.
  • PCB design for assembly (DFA): The process of designing a PCB with the goal of making it easy and cost-effective to assemble.
  • PCB design for cost (DFC): The process of designing a PCB with the goal of minimizing the cost of the materials, fabrication, assembly, and other aspects of the PCB.
  • PCB design for environment (DFE): The process of designing a PCB with the goal of minimizing the environmental impact of the materials, fabrication, assembly, and other aspects of the PCB.
  • PCB design for manufacturing (DFM): The process of designing a PCB to optimize the manufacturing process and minimize costs.
  • PCB design for manufacturing (DFM): The process of designing a PCB with the goal of making it easy and cost-effective to manufacture.
  • PCB design for quality (DFQ): The process of designing a PCB with the goal of maximizing the quality and performance of the final product.
  • PCB design for reliability (DFR): The process of designing a PCB with the goal of increasing its reliability and reducing the risk of failure.
  • PCB design for safety (DFS): The process of designing a PCB with the goal of maximizing the safety of the final product and the users.
  • PCB design for security (DFSec): The process of designing a PCB with the goal of maximizing the security of the final product and the users.
  • PCB design for serviceability (DFS): The process of designing a PCB with the goal of making it easy and cost-effective to repair or modify.
  • PCB design for test (DFT): The process of designing a PCB with the goal of making it easy and cost-effective to test.
  • PCB design for testability (DFT): The process of designing a PCB to facilitate the testing and troubleshooting process.
  • PCB design rule check (DRC): A process of checking the design of a PCB against a set of predefined rules to ensure compliance with industry standards and guidelines.
  • PCB design rule check (DRC): The process of checking a PCB design for compliance with the design rules and guidelines.
  • PCB design: The process of creating a schematic and layout of a printed circuit board.
  • PCB documentation software: A computer program used to create and edit the documentation and drawings for a circuit or PCB.
  • PCB drill file: A file format used to describe the location and size of the holes in a PCB, used for drilling the holes during the PCB fabrication process.
  • PCB drilling: The process of creating holes in a PCB for through-hole components.
  • PCB electromagnetic compatibility (EMC): The ability of a circuit to function correctly in its intended electromagnetic environment without generating or being affected by unwanted electromagnetic interference (EMI).
  • PCB electromagnetic compatibility testing (EMC testing): The process of testing a circuit to ensure that it meets the EMC standards and guidelines for its intended environment.
  • PCB electromagnetic field (EMF): The field of energy that surrounds an electrically charged object, and can cause interference with other electronic devices.
  • PCB electromagnetic interference testing (EMI testing): The process of testing a circuit to ensure that it does not generate or receive unwanted EMI.
  • PCB electromagnetic pulse (EMP): A high-energy burst of electromagnetic energy that can cause damage or failure to electronic devices.
  • PCB electromagnetic radiation: The emission of electromagnetic energy from a circuit, which can be in the form of radio waves, microwaves, or other forms of electromagnetic radiation.
  • PCB electromagnetic susceptibility (EMS): The ability of a circuit to function correctly in the presence of unwanted electromagnetic interference (EMI).
  • PCB electromagnetic wave: A wave of oscillating electric and magnetic fields that can carry energy and information through space.
  • PCB EMI filter: A passive component that is used to reduce the amount of EMI that a circuit receives by filtering out unwanted frequencies.
  • PCB EMI shielding: The process of reducing the amount of EMI that a circuit emits or receives, using methods such as metal enclosures, gaskets, and coatings.
  • PCB EMI suppression: The process of reducing the amount of EMI that a circuit generates by using methods such as ferrite beads, capacitors, and inductors.
  • PCB EMI susceptibility: The degree to which a circuit is affected by unwanted EMI.
  • PCB etching: The process of removing unwanted copper from a PCB using chemicals or laser.
  • PCB fabrication drawing file: A file format used to describe the dimensions, materials, and other details of a PCB for the manufacturer.
  • PCB fabrication drawing: A technical drawing that specifies the dimensions, materials, and other details of a PCB for the manufacturer.
  • PCB fabrication software: A computer program used to generate the files and instructions needed for the fabrication of a PCB.
  • PCB fabrication: The process of creating a printed circuit board.
  • PCB footprint: The layout of the pads and other features of a component on a PCB.
  • PCB Gerber file: A file format used to describe the layout of a PCB, including the location of the traces, vias, pads, and other features of the PCB.
  • PCB heat sink: A component or device that is designed to dissipate heat from a circuit.
  • PCB inner layer: A layer within a multi-layer PCB that is sandwiched between the outer layers.
  • PCB inspection machine: A machine that is used to automatically inspect the quality and correctness of the components and connections on a PCB.
  • PCB lamination: The process of bonding multiple layers of copper-clad material together to form a PCB.
  • PCB layer stackup: The arrangement of the different layers of a multi-layer PCB.
  • PCB layout editor: A software tool used to create the physical layout of a PCB.
  • PCB layout software: A computer program used to design and edit the layout of a PCB.
  • PCB layout verification: The process of checking the layout of a PCB for any errors or issues that could affect performance or manufacturability.
  • PCB layout: The physical arrangement of components and traces on a printed circuit board.
  • PCB library file: A file format used to store the footprints, symbols, and other information for the components used in a circuit or PCB.
  • PCB library management software: A computer program used to manage and organize the footprints, symbols, and other information for the components used in a circuit or PCB.
  • PCB library: A collection of PCB footprints and symbols that can be used in schematic capture and PCB layout.
  • PCB manual soldering: A soldering process in which the components are manually placed on the PCB and soldered using a soldering iron or other tool.
  • PCB measurement file: A file format used to store the measurement results and settings for a circuit or PCB.
  • PCB netlist file: A file format used to describe the connectivity of a circuit, including the components, pins, and nets.
  • PCB netlist: A list of all the connections and components in a PCB, used to check the design and generate the fabrication and assembly drawings.
  • PCB pad: A small, flat area on a PCB that provides a connection point for a component lead or trace.
  • PCB pick and place machine: A machine that is used to automatically place the components onto a PCB.
  • PCB plane split: The process of separating a single continuous plane into multiple smaller planes to improve the power distribution and signal integrity of a PCB.
  • PCB plane stitching: The process of connecting multiple planes together to improve the power distribution and signal integrity of a PCB.
  • PCB plating: The process of applying a thin layer of metal on the surface of a PCB to improve its conductivity and corrosion resistance.
  • PCB power delivery network (PDN): The network of traces, vias, and other components that are used to distribute power to the components on a PCB.
  • PCB power delivery system (PDS): The system of components, traces, and planes that delivers power to the various parts of a circuit or PCB.
  • PCB power distribution network (PDN): Same as above
  • PCB power distribution network (PDN): The system of components, traces, and planes that delivers power to the various parts of a circuit or PCB.
  • PCB power grid: The network of power and ground planes and traces on a PCB that are used to distribute power to the components.
  • PCB power integrity analysis: The process of using simulation and measurement techniques to analyze the performance of a circuit’s power delivery system, including the voltage regulator, power planes, and decoupling capacitors.
  • PCB power integrity: The ability of a circuit to deliver stable and clean power to the components, without voltage drop, noise, or other power-related issues.
  • PCB power integrity: The ability of a circuit to provide stable, reliable, and efficient power to the components.
  • PCB power plane analysis: The process of using simulation and measurement techniques to analyze the performance of the power planes on a PCB.
  • PCB power plane decoupling: The process of using decoupling capacitors to reduce the power plane noise and improve the performance of the power distribution network.
  • PCB power plane noise: The noise or ripple on the power plane, caused by the switching of the digital circuits or other factors.
  • PCB power plane optimization: The process of adjusting the size, shape, and other parameters of the power planes on a PCB to optimize the performance of the power distribution network.
  • PCB power plane partitioning: The process of dividing a power plane into smaller sections or regions to improve the performance of the power distribution network.
  • PCB power plane stitching: The process of connecting different sections of a power plane together to improve the performance of the power distribution network.
  • PCB power plane: A dedicated layer on a PCB that is used to distribute power to the components.
  • PCB power plane: A layer of a PCB that is dedicated to carrying power or ground signals.
  • PCB power plane: A plane on a PCB that provides a large surface area for distributing power to the various parts of a circuit.
  • PCB power supply decoupling: The process of using capacitors and other components to reduce the effects of power supply noise and ripple on a circuit.
  • PCB power supply noise: Unwanted signals or fluctuations in the power supply voltage that can affect the performance of a circuit.
  • PCB power supply rejection ratio (PSRR): The ability of a circuit to reject noise and other unwanted signals from the power supply.
  • PCB power supply ripple: The small fluctuations in the voltage of a power supply that can affect the performance of a circuit.
  • PCB power supply sequencing: The process of controlling the order in which the power supplies for different components or subsystems are turned on and off.
  • PCB power supply transient protection: The process of protecting a circuit from sudden and temporary changes in the power supply voltage, such as voltage spikes and power failures.
  • PCB prepreg: A layer of uncured epoxy resin and reinforcement fibers that is used to bond the layers of a multi-layer PCB together.
  • PCB project file: A file format used to store all the information and files related to a circuit or PCB, including the schematic, layout, BOM, and other files.
  • PCB recycling: The process of recovering valuable materials from used or discarded printed circuit boards.
  • PCB reflow soldering: A soldering process in which the components and PCB are heated to a temperature that melts the solder, allowing it to flow and make connections between the components and the PCB.
  • PCB repair: The process of fixing any defects on a printed circuit board.
  • PCB reverse engineering: The process of analyzing a PCB to understand its design and function.
  • PCB rework equipment: The equipment used to repair or modify a circuit or PCB.
  • PCB schematic capture software: A computer program used to create and edit the schematic diagram of a circuit.
  • PCB signal attenuation: The decrease in signal amplitude or strength that occurs along a trace or signal path due to resistance, capacitance, and other factors.
  • PCB signal crosstalk: The unwanted coupling of a signal from one trace or component to another.
  • PCB signal distortion: The change in signal shape or waveform that occurs due to non-linearities, noise, and other factors.
  • PCB signal integrity analysis: The process of using simulation and measurement techniques to analyze the performance of a circuit’s signal traces, vias, and other signal-carrying components.
  • PCB signal integrity debugging: The process of identifying and fixing signal integrity issues in a circuit.
  • PCB signal integrity measurement: The process of measuring the signal integrity performance of a circuit using test equipment such as oscilloscopes, signal generators, and network analyzers.
  • PCB signal integrity optimization: The process of using design techniques and component selection to improve the signal integrity performance of a circuit.
  • PCB signal integrity simulation: The process of using computer software to model and predict the signal integrity performance of a circuit.
  • PCB signal integrity testing: The process of testing a circuit to ensure that it meets the signal integrity specifications and guidelines.
  • PCB signal integrity verification: The process of checking a circuit’s signal integrity performance against the specifications and guidelines.
  • PCB signal integrity: The ability of a circuit to transmit signals with minimal distortion, attenuation, or other signal-related issues.
  • PCB signal plane: A layer of a PCB that is dedicated to carrying signal traces.
  • PCB signal quality: The measure of how closely the signal on a circuit matches the ideal or desired signal.
  • PCB simulation file: A file format used to store the simulation results and settings for a circuit or PCB.
  • PCB simulation software: A computer program used to simulate the performance and behavior of a circuit or PCB.
  • PCB soldering process: The process of soldering the components onto a PCB.
  • PCB surface-mount technology (SMT): A technology in which the components are soldered directly to the surface of the PCB, without the need for through-hole connections.
  • PCB temperature rating: The maximum or minimum temperature at which a PCB or component can operate safely.
  • PCB testing equipment: The equipment used to test the performance and functionality of a circuit or PCB.
  • PCB testing software: A computer program used to test and verify the performance and functionality of a circuit or PCB.
  • PCB testing: The process of testing a printed circuit board to ensure it meets the specifications and functions correctly.
  • PCB thermal analysis: The process of using simulation or measurement techniques to analyze the thermal performance of a circuit or PCB.
  • PCB thermal conductivity: The ability of a material to transfer heat, measured in watts per meter-kelvin (W/m-K).
  • PCB thermal conductivity: The measure of a material’s ability to transfer heat.
  • PCB thermal cycling: The process of repeatedly heating and cooling a PCB or component, which can cause damage or failure over time.
  • PCB thermal design: The process of designing a circuit or PCB with the goal of controlling the temperature.
  • PCB thermal grease: A material applied between the component and the PCB to improve thermal conductivity and heat dissipation.
  • PCB thermal imaging: The process of using a thermal camera to measure the temperature distribution on a PCB or component.
  • PCB thermal imaging: The process of using thermal cameras or other devices to visualize and measure the temperature of a circuit or PCB.
  • PCB thermal management simulation: The process of using computer software to model and predict the temperature distribution and heat flow in a circuit.
  • PCB thermal management: The process of controlling the temperature of a circuit or PCB to ensure that it operates within safe and reliable temperature limits.
  • PCB thermal management: The process of managing the heat generated by a circuit to ensure proper operation and prevent damage to the components.
  • PCB thermal measurement: The process of measuring the temperature of a circuit or PCB using test equipment such as thermocouples or thermal cameras.
  • PCB thermal pad: A material placed between a component and the PCB to improve heat dissipation.
  • PCB thermal pad: A special type of pad that is used to transfer heat from a component to a heat sink or other cooling device.
  • PCB thermal profiling: The process of measuring the temperature of a PCB or component at various points during the soldering process.
  • PCB thermal relief: A small copper pad that is connected to a component pad but not connected to a trace, which allows heat to be transferred from the component to the PCB.
  • PCB thermal resistance: The measure of a material’s ability to resist the transfer of heat.
  • PCB thermal resistance: The resistance to heat flow, measured in degrees Celsius per watt (°C/W).
  • PCB thermal shock: The sudden change in temperature that a PCB or component can experience, which can cause damage or failure.
  • PCB thermal simulation: The process of using computer software to model and predict the thermal performance of a circuit or PCB.
  • PCB thermal vias: Small holes on a PCB that allow heat to be transferred from the component to the other side of the PCB or to a heat sink.
  • PCB thermal vias: Vias that are placed on a PCB to improve heat dissipation.
  • PCB through-hole technology: A technology in which the components are soldered to the PCB by inserting their leads through holes in the PCB, and then soldering the leads to the pads on the other side of the PCB.
  • PCB trace clearance: The distance between a trace and the nearest object on a PCB, which affects the susceptibility of the circuit to EMI and RFI.
  • PCB trace clearance: The minimum distance between a trace and any other conductive feature on a PCB, such as a trace, pad, via, or plane.
  • PCB trace creepage distance: The minimum distance between a trace and any other conductive feature on a PCB, such as a trace, pad, via, or plane, when it is necessary to prevent arcing or other dangerous electrical events.
  • PCB trace impedance calculator: A tool used to calculate the impedance of a trace on a PCB based on its width, spacing, and material properties.
  • PCB trace impedance: The resistance, capacitance, and inductance of a trace on a PCB, which affects the signal integrity and performance of the circuit.
  • PCB trace impedance: The resistance, inductance, and capacitance of a trace, which determines its electrical characteristics and affects the signal integrity of a circuit.
  • PCB trace length matching: The process of ensuring that the lengths of the copper traces on a PCB are matched to within a certain tolerance to reduce signal reflections and improve signal integrity.
  • PCB trace optimization: The process of adjusting the width, spacing, and other parameters of the copper traces on a PCB to optimize the signal integrity, power integrity, or other characteristics of the circuit.
  • PCB trace routing: The process of connecting the various parts of a circuit using traces on a PCB.
  • PCB trace routing: The process of designing the path of the copper traces on a PCB.
  • PCB trace spacing calculator: A tool used to calculate the spacing between two traces on a PCB based on the voltage difference between them.
  • PCB trace spacing: The distance between the copper traces on a PCB, which is typically measured in mils (thousandths of an inch) or micrometers.
  • PCB trace spacing: The distance between two traces on a PCB, which affects the susceptibility of the circuit to electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • PCB trace to pad clearance: The distance between a trace and a pad on a PCB, which affects the reliability of the solder joint between the trace and the pad.
  • PCB trace to pad clearance: The minimum distance between a trace and a pad on a PCB.
  • PCB trace to plane clearance: The distance between a trace and a plane on a PCB, which affects the susceptibility of the circuit to EMI and RFI.
  • PCB trace to plane clearance: The minimum distance between a trace and the closest plane or other conductive feature on a PCB.
  • PCB trace to trace clearance: The distance between two traces on a PCB, which affects the susceptibility of the circuit to EMI and RFI.
  • PCB trace to via clearance: The minimum distance between a trace and a via on a PCB.
  • PCB trace width calculator: A tool used to calculate the width of a trace on a PCB based on the current flowing through it.
  • PCB trace width: The width of a trace on a PCB, which affects its resistance and current-carrying capacity.
  • PCB trace width: The width of the copper traces on a PCB, which is typically measured in mils (thousandths of an inch) or micrometers.
  • PCB trace: The conductive path on a PCB that connects different components.
  • PCB version control software: A computer program used to manage and track changes to the files and information related to a circuit or PCB.
  • PCB via: A small hole on a PCB that allows a trace to pass through from one layer to another.
  • PCB voltage drop: The decrease in voltage that occurs along a trace or power delivery network due to resistance, inductance, and other factors.
  • PCB wave soldering: A soldering process in which the PCB is passed through a wave of molten solder, which flows over the components and makes connections between the components and the PCB.
  • PCB: Printed Circuit Board.
  • Pick and place machine: A machine that automatically places components on a PCB for assembly.
  • PLL (Phase-Locked Loop): A circuit that locks the phase of a local oscillator to the phase of an input signal.
  • Polling: A method of checking the status of a device or signal at regular intervals.
  • Potentiometer: A variable resistor that can be adjusted to control the current flow in a circuit.
  • Power (P): The rate at which energy is transferred in a circuit, measured in watts (W).
  • Power electronic devices: electronic devices that are used to control and convert electric power.
  • Power factor correction: A technique used to improve the power factor of an AC power supply by reducing the harmonic content of the current.
  • Power supply: A device that provides electrical power to a circuit.
  • Real-time systems: A system that processes data and generates outputs as soon as the data is received, with minimal delay.
  • Rectifier: A circuit that converts AC to DC.
  • Rectifier: A circuit that converts AC voltage to DC voltage.
  • Reflow oven: A machine that uses heat to melt the solder paste and attach the components to a PCB.
  • Regulator: A circuit that maintains a constant output voltage or current.
  • Resistance (R): The opposition to current flow in a circuit, measured in ohms (Ω).
  • RFI (Radio-Frequency Interference): Unwanted radio-frequency energy that can interfere with the normal operation of electronic devices.
  • RFI filter: A device that helps reduce the level of RFI in a circuit.
  • Ronald Legarski
  • Root Locus: A graph that shows the location of the roots of a circuit’s characteristic equation in the complex plane.
  • Sample-and-hold circuit: A circuit that captures an input signal and holds its value for a certain period of time.
  • Schematic capture: The process of creating a diagram of the circuit using a computer-aided design (CAD) software.
  • Schmitt trigger: A circuit that converts a noisy input signal into a clean square wave output signal.
  • SCR (Silicon Controlled Rectifier): A type of power electronic device that can be used as a switch or a rectifier.
  • Shielding: The use of conductive material to reduce the penetration of EMI and RFI into a circuit.
  • Short Circuit: An abnormal condition on an electrical circuit, where a current flows through an unintended path with no or very low resistance.
  • Silkscreen: The printed text and graphics on a PCB used to identify the components and their orientation.
  • Simulation: The process of using computer software to model and predict the behavior of a circuit.
  • SMPS (Switched-Mode Power Supply): A type of power supply that uses switching devices to convert electrical power.
  • Solder mask: A thin layer of protective coating applied to a PCB to prevent short circuits caused by solder splashes.
  • Solder paste: A material used to adhere components to a PCB during the soldering process.
  • SPI (Serial Peripheral Interface): A communication protocol that can be used to connect multiple devices to a microcontroller using only a few wires.
  • SPICE (Simulation Program with Integrated Circuit Emphasis): A type of simulation software that can be used to model and analyze electronic circuits.
  • State-Space representation: A mathematical representation of a dynamic system using a set of first-order differential equations, that describe the behavior of the system over time.
  • Superposition theorem: A theorem that states that the voltage or current in any part of a circuit is the sum of the voltages or currents that would be caused by each source acting alone.
  • Sure, here are some additional circuit terminology and related definitions:
  • Surface mount technology (SMT): A method of attaching components to a PCB by soldering them to the surface of the PCB.
  • Switch: A device that can interrupt the flow of current in an electrical circuit.
  • Switching power supply: A power supply that uses a switching converter to maintain a constant output voltage.
  • Thevenin’s theorem: A theorem that states that any combination of voltage sources and resistors can be replaced by a single voltage source in series with a single resistor.
  • Through-hole technology: A method of attaching components to a PCB by inserting leads through holes in the PCB and soldering them on the other side.
  • Timer: A device that generates a signal after a certain period of time.
  • Trace clearance: The distance between a trace and the nearest object on a PCB, which affects the susceptibility of the circuit to EMI and RFI.
  • Trace clearance: The distance between a trace and the nearest object on a PCB, which can affect the susceptibility of the circuit to EMI and RFI.
  • Trace impedance calculator: A tool used to calculate the impedance of a trace on a PCB based on its width, spacing, and material properties.
  • Trace impedance: The impedance of a trace on a PCB, which can affect signal integrity.
  • Trace routing: The process of connecting the various parts of a circuit using traces on a PCB.
  • Trace spacing calculator: A tool used to calculate the spacing between two traces on a PCB based on the voltage difference between them.
  • Trace spacing: The distance between two traces on a PCB, which affects the susceptibility of the circuit to electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • Trace spacing: The distance between two traces on a PCB, which can affect the susceptibility of the circuit to EMI and RFI.
  • Trace to pad clearance: The distance between a trace and a pad on a PCB, which affects the reliability of the solder joint between the trace and the pad.
  • Trace to pad clearance: The distance between a trace and a pad on a PCB, which can affect the reliability of the solder joint between the trace and the pad.
  • Trace to plane clearance: The distance between a trace and a plane on a PCB, which affects the susceptibility of the circuit to EMI and RFI.
  • Trace to plane clearance: The distance between a trace and a plane on a PCB, which can affect the susceptibility of the circuit to EMI and RFI.
  • Trace to trace clearance: The distance between two traces on a PCB, which affects the susceptibility of the circuit to EMI and RFI.
  • Trace to trace clearance: The distance between two traces on a PCB, which can affect the susceptibility of the circuit to EMI and RFI.
  • Trace width calculator: A tool used to calculate the width of a trace on a PCB based on the current flowing through it.
  • Trace width: The width of a trace on a PCB, which affects its resistance and current-carrying capacity.
  • Trace width: The width of a trace on a PCB, which can affect the trace’s impedance and current-carrying capacity.
  • Trace: A path on a PCB that carries electrical current.
  • Transformer: A device that transfers electrical energy from one circuit to another through electromagnetic induction.
  • Transistor: A semiconductor device that can be used as an amplifier or switch.
  • UART (Universal Asynchronous Receiver-Transmitter): A device that can be used to send and receive serial data.
  • Voltage (V): The electrical potential difference between two points in a circuit, measured in volts (V).
  • Wave soldering: A method of soldering components to a PCB by passing the PCB through a wave of molten solder.
  • Waveform: The shape of an electrical signal over time.
  • Waveguide: A hollow metal tube that guides electromagnetic waves.
  • Wireless communication: A method of communicating without the use of physical wires or cables, using different technologies such as Bluetooth, WiFi, Zigbee, LoRa, etc.
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